By KBC Associate 
Samsung’s upcoming Galaxy Z Fold7, expected to be unveiled alongside the Galaxy Z Flip7 and Flip7 FE in New York in early or mid-July, has now been certified by the FCC. Interestingly, this reveals the chipset it will be using in most markets.
The SM-F966B model that was certified is the one intended for international markets (the “B” suffix tells us that in Samsung’s nomenclature), and it is powered by Qualcomm’s Snapdragon 8 Elite chipset. So, it’s more than likely that this chip will be inside the Fold7 across the world, just like all recent rumors have claimed.
It will of course be a different situation for the Flip7, which is expected to mark the debut of Samsung’s long-delayed Exynos 2500 SoC, although it’s still unclear in how many markets that will make an appearance (the leaks don’t seem to agree).
The Fold7 has 5G, Wi-Fi 7, UWB, wireless charging, and reverse wireless charging according to the FCC. Based on past leaks, it will sport an 8.2-inch foldable AMOLED screen with 120 Hz refresh rate, a 6.5-inch FHD+ AMOLED cover display with 120 Hz refresh rate, a 200 MP main camera, a 12 MP ultrawide, a 10 MP telephoto with 3x optical zoom, a 4 MP under-display selfie camera in the foldable screen, a 10 MP hole-punch selfie camera on the cover display, and a 4,400 mAh battery. It will run Android 16 with One UI 8 on top since day one.