Samsung Galaxy Z Flip FE runs Geekbench powered by a chipset you might not like

Samsung Galaxy Z Flip FE runs Geekbench powered by a chipset you might not like


Samsung is working on an FE flip-style foldable, we’ve been hearing that a lot in the past few months. It’s still debatable whether this will be called Galaxy Z Flip FE or Galaxy Z Flip7 FE, but regardless of that (we’ll just call it the Flip FE), we now know the chipset inside.

That’s because a prototype has run Geekbench, and the benchmark’s online database has revealed what’s inside: Samsung’s Exynos 2400 SoC. Not the 2400e that was seen in the Galaxy S24 FE last year, mind you, but the 2400 itself.

As you may know, this SoC was inside the Galaxy S24 and S24+ in some regions, which launched back in January of last year. While that’s quite a long time ago in the mobile world, this was a flagship chipset at the time (people’s issues with the Exynos range aside), and so it should be a decent chip for the presumably cheap Flip FE.

Of course, the pricing itself will make or break this device – at close to $500-600, most people will probably not have an issue with the chipset choice, but if it’s $700-800 or even more, then the conversation will definitely change.

Anyway, the chip was paired with 8GB of RAM in the prototype that ran the benchmark, and the device ran Android 16, which makes us think it might launch with One UI 8 on board. It also tells us that it’s not coming very soon – it could be unveiled alongside the Flip7 and Fold7 in early July or after that, but most likely not sooner, since Google is only planning to release Android 16 in June.

Now let’s address the elephant in the room. Last week a leak purportedly gave us the specs of the Flip FE, and it was said to be powered by the Snapdragon 8 Gen 3 SoC. Either that leak was wrong, or Samsung is planning on releasing the device with two different chips in different regions, which wouldn’t be surprising given how much it’s done that for the flagship Galaxy S family in the past.





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